JPH0214218Y2 - - Google Patents
Info
- Publication number
- JPH0214218Y2 JPH0214218Y2 JP7328582U JP7328582U JPH0214218Y2 JP H0214218 Y2 JPH0214218 Y2 JP H0214218Y2 JP 7328582 U JP7328582 U JP 7328582U JP 7328582 U JP7328582 U JP 7328582U JP H0214218 Y2 JPH0214218 Y2 JP H0214218Y2
- Authority
- JP
- Japan
- Prior art keywords
- case
- wiring board
- front case
- adhesive
- synthetic resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229920003002 synthetic resin Polymers 0.000 claims description 13
- 239000000057 synthetic resin Substances 0.000 claims description 13
- 238000007789 sealing Methods 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 description 16
- 230000001070 adhesive effect Effects 0.000 description 16
- 239000004973 liquid crystal related substance Substances 0.000 description 13
- 125000006850 spacer group Chemical group 0.000 description 13
- 239000003973 paint Substances 0.000 description 6
- 238000009751 slip forming Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Calculators And Similar Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7328582U JPS58175673U (ja) | 1982-05-19 | 1982-05-19 | 小型電子機器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7328582U JPS58175673U (ja) | 1982-05-19 | 1982-05-19 | 小型電子機器 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58175673U JPS58175673U (ja) | 1983-11-24 |
| JPH0214218Y2 true JPH0214218Y2 (en]) | 1990-04-18 |
Family
ID=30082798
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7328582U Granted JPS58175673U (ja) | 1982-05-19 | 1982-05-19 | 小型電子機器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58175673U (en]) |
-
1982
- 1982-05-19 JP JP7328582U patent/JPS58175673U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58175673U (ja) | 1983-11-24 |
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